Silver coating
Telecommunications, plating
| Base Material |
Chemical composition in % |
Density g/cm3 lb/in3 |
Resistivity @ 20°C µΩ.cm Ω cmil/ft |
Tensile Strength |
Solid wire mm awg |
Stranded mm² awg |
Ribbon 
Bobbins | |
|---|---|---|---|---|---|---|---|---|
| hard daN/mm² psi |
soft daN/mm² psi | |||||||
| ETP Copper | Cu 99.9 % | 8,93 .323 |
1,724 10.371 |
45 65,000 |
24 35,000 |
0,020-2,500 10 to 52 |
0,005-13,24 6 to 40 |
|
| OF Copper | Cu 99.95 % O2 15ppm | 8,93 .323 |
1,724 10.371 |
45 65,000 |
24 35,000 |
0,020-2,500 10 to 52 |
0,005-13,24 6 to 40 |
|
| (*) Nickel plated copper | Weight of Ni coating >2 % | 8,93 .323 |
1,834 11.033 |
45 65,000 |
24 35,000 |
0,100-0,800 20 to 38 |
0,05-13,24 6 to 30 |
|
| Copper Phosphor | P 50-100 ppm Cu Balance | 8,93 .323 |
1,870 11.249 |
45 65,000 |
24 35,000 |
0,025-1,500 14 to 50 |
0,012-13,24 6 to 36 |
|
| Cuprofor© (RoHS) | P 0.08% Co 0.28 % Cu Balance | 8,93 .323 |
2,300 13.836 |
65 94,000 |
40 58,000 |
0,030-0,800 20 to 48 |
0,005-13,24 6 to 40 |
|
| Green6 TM (RoHS) | Cu 99% Mg 1% | 8,93 .323 |
2,155 12.962 |
65 94,000 |
40 58,000 |
0,030-0,800 20 to 48 |
0,005-13,24 6 to 40 |
|
| Copper Clad Aluminum (CCA) | Cu 15% of the total weight | depends on Ag Thickness | 2,676 16.096 |
20 29,000 |
14 20,000 |
0,100-2,450 10 to 38 |
0,20-8,40 8 to 24 |
|
| Copper Clad Steel (CCS) 40% IACS | Cu thickness 10% of the wire radius | 8,13 .294 |
4,397 26.450 |
75,8 110,000 |
34,5 50,000 |
0,050-1,000 18 to 44 |
0,012-13,24 6 to 36 |
|
| Bronze 6 | Sn 6 % P 0.15 % Cu Balance | 8,85 .320 |
11,90 71.586 |
100 145,000 |
44 64,000 |
0,040-1,000 18 to 46 |
- |
|
| Brass 80/20 | Cu 80% Zn 20% | 8,65 .312 |
5,30 31.833 |
85 123,000 |
38 55,000 |
0,040-1,000 18 to 46 |
- |
|
| Pure Nickel | Ni 99.2 % | 8,93 .323 |
9,50 57.149 |
87 126,000 |
45 65,000 |
0,100-1,000 18 to 38 |
- |
|
All data given in these tables should be considered as typical or average. Variations in properties can occur.
(*) Dual plating