Gold coating
Embroidery, haute couture, electronic connectors.
| Base Material |
Chemical composition in % |
Density g/cm3 lb/in3 |
Resistivity @ 20°C µΩ.cm Ω cmil/ft |
Tensile Strength |
Solid wire mm awg |
Stranded mm² awg |
Ribbon | |
|---|---|---|---|---|---|---|---|---|
| hard daN/mm² psi |
soft daN/mm² psi | |||||||
| (*) Silver Plated Copper | Weight of Ag coating > 1 % | 8,93 .323 |
1,724 10.371 |
45 65,000 |
24 35,000 |
0,040-0,800 20 to 46 |
0,013-4,950 12 to 40 |
|
| (*) Nickel Plated Copper | Weight of Ni coating > 2 % | 8,93 .323 |
1,724 10.371 |
45 65,000 |
24 35,000 |
0,040-0,800 20 to 46 |
0,013-4,950 12 to 40 |
|
| Imitation Gold | Flash of Zn plated copper | 8,93 .323 |
1,880 11.309 |
45 65,000 |
24 35,000 |
0,080-0,800 20 to 40 |
0,013-4,950 12 to 40 |
|
| 990 Silver | Ag 99 % | 10,47 .378 |
2,100 12.633 |
44 64,000 |
22 32,000 |
0,060-0,800 20 to 46 |
0,013-4,950 12 to 40 |
|
| Pure Nickel | Ni 99.2 % | 8,9 .321 |
9,500 57.148 |
87 126,000 |
45 65,000 |
0,100-0,800 20 to 38 |
- | - |
| Brass 80/20 | Cu 80 % Zn 20 % | 8,65 .312 |
8,65 31.883 |
85 123,000 |
38 55,000 |
0,100-0,800 20 to 38 |
- |
|
All data given in these tables should be considered as typical or average. Variations in properties can occur.
(*) Dual plating